The HBX-G500 is a high-performance FPGA accelerator card built around the Achronix Speedster7t AC7t1550, delivering unmatched compute density, ultra-low latency, and scalable AI performance. Designed for AI/ML, high-performance computing (HPC), and advanced networking, it enables real-time inference, massive parallel processing, and wire-speed data acceleration—outperforming traditional CPU/GPU solutions in efficiency and throughput.

Key Innovations:
·   Industry-Leading AI Performance – Optimized for LLM inference, delivering higher tokens/sec and lower latency than GPU-based solutions for text generation, chatbots, and AI content creation.
·   Breakthrough Speech Recognition – Supports 2,400+ simultaneous audio streams with <3% WER (Word Error Rate) and <25ms latency, ideal for real-time transcription, contact centers, and voice AI.
·   Networking at Scale – 400GbE wire-speed processing with 16x GDDR6 (3.5Tbps bandwidth) enables real-time traffic analysis, packet filtering, and AI-driven network optimization.
·   2D Network-on-Chip (NoC) – 80-node AXI4 interconnect ensures zero-bottleneck data flow between 2560 MLP cores, memory, and high-speed I/O, maximizing throughput for AI training and inference.

Why Choose HBX-G500?

·   Outperforms GPUs in latency-sensitive AI workloads;

·   400G wire-speed networking + 3.5Tbps memory bandwidth;

·   Scalable from edge to cloud with PCIe Gen5 & SR-IOV.

AI / ML Acceleration

     ·   61.4 TOPS (INT8) via 2,560 MLP cores;

     ·   Supports LLM inference (comparable to NVIDIA A100/H100 at small batch sizes);

     ·   Ultra-low latency AI pipelines for real-time decision-making.

High-Speed Networking

     ·   Dual-mode Ethernet;           

     ·   QSFP56 (200G): 1×200G or 4×50G;

     ·   QSFP-DD (400G): 1×400G or 8×50G;

     ·   PCIe Gen5 x16/x4 (SR-IOV support: 4PFs, 256 VFs);

     ·   16x GDDR6 (32GB, 3.5Tbps) for high-bandwidth data streaming.

Compute & Memory

     ·   Achronix Speedster7t AC7t1550 FPGA;

     ·   1.5M Logic Elements (LE);

     ·   195MB on-chip memory;

     ·   2D NoC (2GHz, 256-bit bus);

     ·   Flexible memory architecture;

     ·   2560×72Kb + 2560×2Kb block RAM;

     ·   32-channel GDDR6 (12/14Gbps per lane).

Physical & Environmental

    ·   Form Factor: Full-height, full-length dual-slot PCIe;

    ·   Operating Temp.: -40°C to +85°C (extended range available).

Optional Configurations:

     ·   Custom Firmware (Optimized for TensorFlow/PyTorch);

     ·   Extended Temp. (-55°C to +105°C) for military/industrial use;

     ·   Bulk Pricing (>25 units).