XZM-7024—High-Performance FMC/FMC+ Carrier Board with Zynq UltraScale+ MPSoC Detailed Description-Johlink Electronic Technology Co.,Ltd

XZM-7024—High-Performance FMC/FMC+ Carrier Board with Zynq UltraScale+ MPSoC Detailed Description

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Detailed Description Key Specifications Ordering Information

The XZM-7024 is a versatile FPGA carrier board designed for high-speed signal processing, real-time algorithm verification, and rapid test environment deployment. Built around the Xilinx Zynq UltraScale+ MPSoC (default: XCZU19EG-2FFVC1760), it combines programmable logic with ARM Cortex-A53/R5 processors, offering a cost-effective solution with scalable logic resources (optionally downgradable to XCZU17EG or XCZU11EG).

Product Highlights

· Dual FMC/FMC+ Support:

· 1× FMC (HPC, VITA57.1): 72 high-speed diff pairs, 8× 16-lane DP diff pairs, and 2 ultra-high-speed clock pairs.

· 1× FMC+ (HSPC, VITA57.4): 84 high-speed diff pairs, 24× 48-lane DP diff pairs, 6 clock pairs, plus dedicated reference/sync clocks.

· High-Speed Memory:

· 2× DDR4-2400 banks (16+2GB each, expandable to 32+4GB per bank) with ECC support.

· 2× 4-bit SPI Flash (configured as 8-bit bootloader) + eMMC/Micro SD for flexible storage.

· Rich I/O Options:

· 2× QSFP28 (64Gbps optical), PCIe 3.0 x4/SRIO x8/Aurora, USB 3.0, Gigabit Ethernet, Mini DP, CAN, UART, and GPIO.

· Debug & Monitoring: Micro USB (JTAG), Mini USB (UART), and onboard power/temperature sensors.

Applications

· FPGA Signal Processing: Real-time multi-algorithm processing for radar/SDR.

· Test & Measurement: Rapid setup for high-speed data acquisition (ADC/DAC mezzanine cards).

· Wireless & Defense: Fiber-optic comms, electronic warfare, and embedded AI.

1. FPGA & Processing

Component	Specification
Default FPGA	Xilinx Zynq UltraScale+ XCZU19EG-2FFVC1760 (1.5M logic cells, 3,888 DSP slices, 32.1 Mb BRAM)
Optional FPGAs	XCZU17EG-FFVC1760 (1.1M logic cells) / XCZU11EG-FFVC1760 (600K logic cells)
Processing System	Quad-core ARM Cortex-A53 @ 1.5GHz + Dual-core Cortex-R5 @ 600MHz
Configuration	2× 4-bit SPI Flash (combined as 8-bit bootloader) + eMMC (default 16GB)

2. Memory & Storage

Type	Capacity/Speed	Details
DDR4 SDRAM (PS)	16GB + 2GB (ECC) per bank	2400 Mbps, 64-bit bus, expandable to 32GB+4GB
DDR4 SDRAM (PL)	16GB + 2GB (ECC) per bank	Independent 64-bit channel
SPI Flash	2× 1Gb (4-bit mode)	Configurable for fail-safe boot
Storage	M.2 SATA SSD (2280/22110)	PCIe Gen2 x1 link (optional NVMe support)
	MicroSD slot	Bootable, supports SD 3.0 (UHS-I)

3. FMC/FMC+ Interfaces

Interface	Signals	Performance
FMC (HPC, VITA57.1)	72 LVDS pairs (up to 10Gbps)	2× diff clocks (≤12.5GHz)
	8× 16-lane DP (16Gbps per lane)	2× ultra-high-speed clocks
FMC+ (HSPC, VITA57.4)	84 LVDS pairs (up to 12Gbps)	4× diff clocks (≤14GHz)
	24× 48-lane DP (25Gbps per lane)	6× ultra-high-speed clocks
	2× ref clock pairs + 2× sync clock pairs	JESD204B/C compliant

4. High-Speed I/O

Interface	Protocols	Performance
QSFP28 (×2)	100G Ethernet, InfiniBand	64Gbps per port (4× 25G lanes)
PCIe	Gen3 x4 (via HS expansion)	32Gbps aggregate
SRIO/Aurora	SRIO 2.1 x8 / Aurora 8B10B	20Gbps per lane
USB 3.0	SuperSpeed (5Gbps)	Type-A connector

5. Peripheral Interfaces

Type	Details
Ethernet	10/100/1000BASE-T (RJ45)
Display	Mini DisplayPort 1.2 (4K @ 30Hz)
Serial/CAN	DB9 UART (RS-232) + 4-pin CAN 2.0B
GPIO	13-pin J30J (3.3V, 8mA per pin)
Clock Input	SSMC connector (10MHz–1GHz, LVDS/LVPECL)

6. Power & Environmental

Parameter	Specification
Input Voltage	12V DC ±5% (4-pin Molex)
Power Monitoring	Onboard sensors (±1% accuracy)
Operating Temp	-40°C to +85°C (industrial grade)
Cooling	Passive heatsink + optional fan header

Model	FPGA Option	Included Accessories
XZM-7024-ZU19	XCZU19EG-2FFVC1760 (Default)	Power adapter, USB cables, documentation
XZM-7024-ZU17	XCZU17EG-FFVC1760	Contact sales for customization
XZM-7024-ZU11	XCZU11EG-FFVC1760	Optional FMC+ daughter cards available

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